Products / Perforated Trays
MAPESA has the capability of manufacturing almost any type of sieve (perforated) tray. Although one half inch diameter holes are the most commonly used size, we have tooling for punching holes as small as 1/8″ diameter (for 14 ga. tray decks) up to 1 17/32″ diameter. Our ability to “gang punch” and “cluster punch” perforations allows us to be very competitive when large quantities of hole punching is required and would otherwise require many additional fabrication hours for the punching process.
The perforated tray depicted below is a single pass design with swept-back outlet weirs and peripheral baffles.